Grandway Advised Telink Semiconductor on IPO Project Approved by Listing CSSE

On March 28, 2023, Telink Semiconductor (Shanghai) Co.,Ltd. (“Telink Semiconductor”) was approved by Listing CSSE ChiNext in 2023 at its 19th deliberation meeting for initial public offering of shares and listing on ChiNext.

Established in 2010, Telink Semiconductor is mainly engaged in the R&D, design and sales of wireless IoT system-on-chip, focusing on the development of cutting-edge technologies and breakthroughs in the field of wireless IoT chips. Telink Semiconductor has a wide range of wireless IOT SoC products, focusing on low-power Bluetooth SoC products, expanding multi-mode SoC products compatible with various IOT application protocols, and further developing ZigBee protocol SoC products, 2.4G private protocol SoC products, and audio SoC products, as well as providing self-developed firmware protocol stacks and reference application software to downstream clients. Telink Semiconductor’s products are widely used in many famous brands such as Hanshow, Xiaomi, Logitech, Home Control, Tuya Inc, Ledvance, Renesas, IFLYTEK, Skyworth, Sharp, Panasonic, Nvidia, Harman, etc. We have entered the supply chain of major international operators such as Charter and Telecom Italia, and support and serve the products of Baidu, Alibaba, Google, Amazon and many other technology companies in the international and domestic ecosystem.

Telink Semiconductor plans to issue not more than 60,000,000 shares and raise funds of RMB 1,323,636,500.00, which will be used for the IoT product technology upgrade project, wireless audio product technology upgrade project, WiFi and multi-mode product R&D and technology upgrade project, R&D center construction project and development and technology reserve project. It will help to continuously improve and enhance the design and development capability of the company’s low-power wireless IoT system-level chip products and further enhance the company’s market competitiveness.